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Elon Musk's Terafab superfactory aims to produce 1 million wafers a month

Tesla and SpaceX joint venture Terafab plans to reach memory chip production volumes comparable to Samsung by 2032.

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Elon Musk's Terafab superfactory aims to produce 1 million wafers a month

Tesla and SpaceX joint chip venture, Terafab, has announced ambitious plans to reach a production capacity of about 1 million silicon wafers per month by 2032. The company shared these details with equipment suppliers, signaling a massive push into semiconductor manufacturing.

  • Target production capacity of 1 million wafers per month by 2032
  • 700,000 wafers allocated for memory chips and 300,000 for logic processors
  • Initial investments for the Texas complex estimated at $16.8 billion
  • Project involves collaboration between Tesla, SpaceX, and Intel

Production breakdown and Samsung comparison

Out of the total projected volume, 700,000 wafers per month will be directed towards memory chip production, while another 300,000 will be used for logic processors. For comparison, current Samsung DRAM production capacities are estimated at roughly 650,000 to 700,000 wafers per month. If Elon Musk's plans materialize, the new manufacturer will achieve memory production volumes comparable to the industry's largest player in just six years.

Terafab is a large-scale initiative designed to create a dedicated production base for processors and memory needed for Optimus humanoid robots and space-based data centers. Intel has also joined the project to lend its expertise. Ultimately, Musk aims to bring the system's annual productivity to 1 teraflop or 1 terawatt equivalent of computing power specifically for artificial intelligence workloads.

Infrastructure and full-cycle manufacturing

Initial investments in the complex located in Grimes County, Texas, are estimated at $16.8 billion, with the enterprise area eventually expanding to approximately 9.3 million square meters. Terafab is designed to integrate nearly the entire semiconductor production cycle under one roof—from photomask fabrication and lithography to chiplet packaging and testing. According to the developers, this will reduce new chip development cycles from the current 6–9 months down to just a few weeks.

Source: iXBT.com

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